Copper and copper alloys in electronic materials.

Electronic structure of copper-rich copper-gold alloys.

We present and discuss angle-resolved photoemission measurements from the (111) and (100) faces of CuAu single crystals containing 10 at. %%u oA u in th ebul k, togethe rwit hcomputation sof complex-energy bands and densities of states in the Cu90Aulo random alloy. Our calculations permit (.' a good understanding of the shifts and smearings in t e spectrum of Cu arising from the addition of Au ...

Soldering and brazing of copper and copper alloys

Wettability of Brazing Filler Metals on Copper and Copper Alloys

The possibility of alloying can not be avoided at the interface between molten brazing filler metal and base metal in brazing, so the wettability of brazing filler metal can not be easily explained theoretically. We used the original apparatus for wettability test and investigated the relation between the wettability of brazing filler metals of Ag-P-Cu and Ag-Cu-Zn-Cd systems on copper and the ...

Inhibition Mechanisms of Organic Compounds on Copper and Copper Alloys

Copper Alloys in Investment Casting Technology

S. Rzadkosz, J. Zych, A. Garbacz-Klempka, J. Kozana, M. Piękoś, J. Kolczyk, Ł. Jamrozowicz, AGH University of Science and Technology, Faculty of Foundry Engineering, Krakow, Poland M. Kranc, Foundry Research Institute, Krakow, Poland T. Stolarczyk, Copper Museum in Legnica, Poland This paper presents research results in the field of casting technology of copper and copper alloys using the inves...